
Qualcomm Smart Audio Platform Development Kit
Designed with engineering input from TGI Technology and Excelpoint Technology for Qualcomm
The Qualcomm Smart Audio Platform Development Kit was developed to help OEM manufacturers reduce the time and cost required to develop smart speakers by integrating both hardware and software into a single hub for convenient testing.

The development set was designed with the Qualcomm chip in a separate module from the main speaker body to allow for convenient testing by engineers. The form of the speaker body was relatively simple, yet equipped with quality audio engineering system associated with TGI Technology (parent company of UB+).

The chip module was designed with the use of acrylic boards and spacer screws to allow for easy changing of the chip when necessary.

Basic controls were implemented, together with a microphone array system, that was held at the top of the speaker.

Image Credit:
Qualcomm CES 2018 Press Kit
The Qualcomm Smart Audio Platform Development Kit was unveiled to much fanfare at CES 2018.